| 000 | 00952cam a22003251 4500 | ||
|---|---|---|---|
| 100 | _aLee, Ning-Cheng | ||
| 040 | _beng | ||
| 041 | _aeng | ||
| 245 | _aReflow soldering processes and troubleshooting : SMT, BGA, CSP and flip chip technologies | ||
| 260 | _bNewnes | ||
| 260 | _aBoston | ||
| 260 | _c2001 | ||
| 260 | _cc2001 | ||
| 270 | _dUS | ||
| 300 | _aix, 269 p. : ill. ; 26 cm. | ||
| 245 | _cNing-Cheng Lee | ||
| 500 | _aIncludes bibliographical references and index | ||
| 020 | _a9780750672184 | ||
| 650 | 0 | _aElectronic apparatus and appliances - Design and construction | |
| 650 | 0 | _aSolder and soldering | |
| 650 | 0 | _aSurface mount technology | |
| 650 | 0 | _aBall grid array technology | |
| 650 | 0 | _aChip scale packaging | |
| 650 | 0 | _aElectronic packaging | |
| 650 | 0 | _aElectric connectors | |
| 650 | 0 | _xTK | |
| 050 | _aTK7836.L43 2011 | ||
| 942 | _cPRINT | ||
| 999 |
_c84125 _d84125 |
||
| 970 |
_a51 _bMohamad Barham _c51 _dMohamad Barham |
||