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Electronic assembly fabrication : chips , circuit boards , packages , and components Charles A. Harper, editor-in-chief by Series: Electronic packaging and interconnection series
Edition: 1st ed.
Material type: Text Text
Language: English
Publication details: McGraw-Hill ; New York ; 2002; c2002
Availability: Items available for loan: المكتبة الرئيسية (1)Location, call number: الطابق الثاني ب TK7870.E44 2002.

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Electronic materials and processes handbook Charles A. Harper and Ronald N. Sampson by Series: Electronic packaging and interconnection series
Edition: 2nd ed.
Material type: Text Text
Language: English
Publication details: McGraw-Hill ; New York ; 1994; 1994
Availability: Items available for loan: المكتبة الرئيسية (1)Location, call number: الطابق الثاني ب TK7836.E4653 1993.

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