TY  - BOOK
TI  - Modeling of Adhesively Bonded Joints
SN  - 978-1-58829-604-7
AV  - كتب إلكترونية 
PB  - Springer
KW  - Engineering
N1  - Subscription to database on August 2010
UR  - http://springerlink.com/openurl.asp?genre=book&isbn=978-3-540-79055-6
ER  -