Reflow soldering processes and troubleshooting : SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee
Material type: TextLanguage: English Publication details: Newnes; Boston; 2001; c2001Description: ix, 269 p. : ill. ; 26 cmISBN:- 9780750672184
- TK7836.L43 2011
Item type | Current library | Call number | Copy number | Status | Date due | Barcode | |
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المكتبة الرئيسية الطابق الثاني ب | TK7836.L43 2011 (Browse shelf(Opens below)) | 1 | Available | 0000103713 |
Includes bibliographical references and index
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